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lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 1 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen features ? popular t-1 3/4 round package. ? choice of various viewing angles. ? available on tape and reel. ? reliable and robust. ? esd-withstand voltage: up to 4kv. ? the product itself will remain within rohs compliant version . descriptions ? the series is specially designed for applications requiring higher brightness. ? the led lamps are available with different colors ,intensities, epoxy colors, etc. applications ? status indicators. ? commercial use. ? advertising signs. ? back lighting. device selection guide led part no. chip mterial emitted color lens color stopper 7383/r2c3-amqb algainp brilliant red water clear no 7383/r2c3-amqb/p algainp brilliant red water clear yes
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 2 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen package dimensions stopper type no stopper type notes: ? all dimensions are in millimeters, tolerance is 0.25mm except being specified. ? lead spacing is measured where the lead emerges from the package. ? protruded resin under flange is 1.5mm max led.
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 3 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen absolute maximum ratings (ta=25
) parameter symbol rating units forward current i f 50 ma pulse forward current *1 i fp 160 ma operating temperature t opr -40 ~ +85
storage temperature t stg -40 ~ +100
electrostatic discharge esd 4k v soldering temperature *2 t sol 260
power dissipation p d 120 mw zener reverse current iz 100 ma reverse voltage v r 5 v notes: *1:i fp conditions--pulse width 10msec and duty 1/10. *2:soldering time 5 seconds. electro-optical characteristics (ta=25
) parameter symbol condition min. typ. max. units forward voltage v f i f =20ma 1.8 2.0 2.6 v zener reverse voltage vz i z =5ma 5.2 -- -- v luminous intensity i v i f =20ma 2850 4500 7150 mcd viewing angle 2 1/2 i f =20ma -- 30 -- deg peak wavelength ? p i f =20ma -- 632 -- nm dominant wavelength ? d i f =20ma 618 624 628 nm spectrum radiation bandwidth ? i f =20ma -- 20 -- nm reverse current i r v r =5v -- -- 50 ? a
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 4 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen rank combination (i f =20ma) rank p q r s luminous intensity 2850~3600 3600~4500 4500~5650 5650~7150 *measurement uncertainty of luminous intensity: ? 10% unit: :mcd rank 1 2 3 4 forward voltage 1.8~2.0 2.0~2.2 2.2~2.4 2.4~2.6 *measurement uncertainty of forward voltage: ? 0.1v unit:v rank 1 2 3 dominant wavelength 618~620 620~624 624~628 *measurement uncertainty of dominant wavelength ? 1.0nm unit:nm *the quantity ratio of the ranks is decided by everlight.
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 5 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen 0 20 40 60 80 100 0 10 20 30 40 50 60 f o r w a r d c u r r e n t ( m a ) ambient temperature ta( o c) 450 500 550 600 650 700 0.0 0.2 0.4 0.6 0.8 1.0 r e l a t i v e i n t e n s i t y ( a . u . ) wavelength(nm) 1.0 1.5 2.0 2.5 3.0 3.5 0 10 20 30 40 50 f o r w a r d c u r r e n t ( m a ) forward voltage(v) 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 r e l a t i v e l u m i n o u s i n t e n s i t y ( a . u . ) forward current(ma) 25 30 35 40 45 50 55 60 65 70 0.0 0.5 1.0 1.5 2.0 r e l a t i v e l u m i n o u s i n t e n s i t y ( a . u . ) ambient temperature ta( o c) 0 10 20 30 40 50 60 70 80 90 o o o o o o o o o o 0 1.0 1.0 0.5 30 o 60 o 90 o 0.5 0 r e l a t i v e i n t e n s i t y ( a . u . ) radiation angle typical electro-optical characteristics curves relative intensity vs. wavelength forward current vs. forward voltage relative intensity vs. ambient temp. relative intensity vs. forward current forward current vs. ambient temp. radiation characteristics
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 6 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen 1c &-&$53045"5*$&-&$530/"(/&5*$ ."(/&5*$033"%*0"$5*7&3&-%4 boujtubujdgps label packing specification ? anti-electrostatic bag ? inner carton ? outside carton made in taiwan: production place ? packing quantity 1. 500 pcs/1 bag 5 bags/1 inner carton 2. 10 inner cartons/1 outside carton ? label form specification cpn: customer?s production number p/n : production number qty: packing quantity cat: rank of luminous intensity and forward voltage hue: rank of dominant wavelength ref: reference lot no: lot number made in taiwan: production place
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 7 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen notes 1. lead forming ? during lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming should be done before soldering. ? avoid stressing the led package during leads forming. the stress to the base may damage the led?s characteristics or it may break the leds. ? cut the led leadframes at room temperature. cutting the leadframes at high temperatures may cause failure of the leds. ? when mounting the leds onto a pcb, the pcb holes must be aligned exactly with the lead position of the led. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. 2. storage ? the leds should be stored at 30c or less and 70%rh or less after being shipped from everlight and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. ? please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. soldering ? careful attention should be paid during soldering. when soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. ? recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 max.
(30w max.) preheat temp. 100 max.
(60 sec max.) soldering time 3 sec max. bath temp. & time 260 max., 5 sec max distance 3mm min.(from solder joint to epoxy bulb) distance 3mm min. (from solder joint to epoxy bulb)
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 8 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen prehead laminar wave fluxing ? avoiding applying any stress to the lead frame while the leds are at high temperature particularly when soldering. ? dip and hand soldering should not be done more than one time ? after soldering the leds, the epoxy bulb should be protected from mechanical shock or vibration until the leds return to room temperature. ? a rapid-rate process is not recommended for cooling the leds down from the peak temperature. ? although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the leds. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. cleaning ? when necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. dry at room temperature before use.
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 9 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen ? do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the led 5. circuit protection ? below the zener reference voltage vz, all the current flows through led and as the voltage rises to vz, the zener diode ?breakdown." if the voltage tries to rise above vz current flows through the zener branch to keep the voltage at exactly vz. ? when the led is connected using serial circuit, if either piece of led is no light up but current can?t flow through causing others to light down. in new design, the led is parallel with zener diode. if either piece of led is no light up but current can flow through causing others to light up.
lifecyclephase: revision : 2 expired period: forever release date:2009-01-21 08:15:09.0 technical data sheet 7383/r2c3-amqb/x everlight electronics co., ltd. http\\:www.everlight.com rev 2 page: 10 of 10 device number : dle-0000741 prepared date:01-13-2009 prepared : flourix chen 6. heat management ? heat management of leds must be taken into consideration during the design stage of led application. the current should be de-rated appropriately by referring to the de-rating curve found in each product specification. ? the temperature surrounding the led in the application should be controlled. please refer to the data sheet de-rating curve. 7. esd (electrostatic discharge) ? electrostatic discharge (esd) or surge current (eos) can damage leds. ? an esd wrist strap, esd shoe strap or antistatic gloves must be worn whenever handling leds. ? all devices, equipment and machinery must be properly grounded. ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic le ns as a result of friction between leds during storage and handing. 8. other ? above specification may be changed without notice. everlight will reserve authority on material change for above specification. ? when using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. everlight assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. ? these specification sheets include materials protected under copyright of everlight corporation. please don?t reproduce or cause anyone to reproduce them without everlight?s consent. everlight electronics co., ltd. tel: 886-2-2267-2000, 2267-9936 office: no 25, lane 76, sec 3, chung yang rd, fax: 886-2267-6244, 2267-6189, 2267-6306 tucheng, taipei 236, taiwan, r.o.c http:\\www.everlight.com

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